United States Patent 3,538,597
November 10, 1970

Flatpack Lid And Method
Charles Z. Leinkram
Michael A. Shimkus

Filed July 13, 1967
Image of US PATENT 3,538,597

Abstract of the Disclosure

This invention is directed to a method of securing an economical cover to a package which may contain integrated circuits as well as other microelectronic systems. The cover may be formed from a strip of Kovar or other metal with a solder cladding and then applied to the package at a temperature of about 200 degrees centigrade. Such a cover encloses the microelectronic elements within a housing for protection thereof
Figure descriptions: cover graphic

  • Figure 1 illustrates a cross sectional view depicting a prior art method of securing a lid to a flat pack;
  • Figure 2 illustrates a cross sectional view of the method of securing a lid to a flat pack according to the present invention;
  • Figure 3 illustrates a lid secured onto a flat pack according to the present invention.

 Citations [54]:
3,072,832 01/1963 Kilby 3,202,489 08/1965 Bender 3,271,625 09/1966 Caracciolo 3,292,240 12/1966 McNutt 3,312,771 04/1967 Hessinger 3,322,517 05/1967 Miller 3,340,602 09/1967 Hontz 3,422,340 01/1969 Wooding 3,383,454 05/1968 Dix 3,381,372 05/1968 Capano 3,374,537 03/1968 Doelp 3,337,678 08/1967 Stelmak 3,187,240 01/1965 Clark 1,779,884 10/1930 Lange
National Museum of American History
HomeSearchChip TalkChip FunPatentsPeoplePicturesCreditsCopyrightComments