Abstract of the Disclosure

A thick film device that utilizes a flip chip type of semiconductor device mounted in an inverted manner on a thick film sustrate.

• Figure 1 is a diagrammatic view of a semiconductor utilized in one embodiment of the invention.
• Figure 2 is an end view illustrating the mounting of the device of Figure 1 on a thick film substrate.
• Figure 3 is a diagrammatic view of a device illustrating another embodiment of the invention.
• Figure 4 is an end view illustrating the mounting of the device of Figure 3 on a thick film substrate.

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