PATENT COVER GRAPHIC |
United States Patent 4,136,349 January 23, 1979 IC Chip With Buried Zener Diode Wei K. Tsang Filed May 27, 1977 |
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Abstract of the DisclosureAn IC chip having a Zener diode with a subsurface breakdown junction to assure stable operation. The diode is formed by a triple diffusion process compatible with conventional bipolar processing. A deep p++ diffusion first is applied, reaching through the epitaxial region to the buried n+ layer; next, a shallow p+ diffussion is formed over the deep p++ diffusion and extending laterally beyond that diffusion; finally, a shallow n+ diffusion is applied over the p diffusions, to form a subsurface breakdown junction therewith . The topology of the mask windows is selected to provide concentration profiles which insure that the breakdown occurs at the subsurface junction, and that other desirable diode characteristics are achieved |
Figure descriptions: cover graphic |
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Citations [54]:3,378,915 04/1968 Zenner 3,881,179 04/1975 Howard |
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