United States Patent 4,199,379
April 22, 1980

Method For Producing Metal Patterns On Silicon Wafers For Thermomigration
Tiberiu Mizrah

Filed September 15, 1978
Image of US PATENT 4,199,379

Abstract of the Disclosure

A method of producing metal patterns on silicon wafers prior to a thermomigration process, including covering the surface of a wafer completely with a metal film, producing a photoresist pattern on portions of the metal film corresponding to a predetermined thermomigration pattern, etching away the uncovered portions of the metal film, removing the photoresist film, and annealing the remaining metal film pattern.
Figure descriptions: cover graphic

  • Figure 1 is a schematical representation of a silicon wafer having a metal film layer formed thereon.
  • Figure 2 is a schematical representation of the metallized silicon wafer of Figure 1 with a photoresisted pattern formed thereon.
  • Figure 3 is a schematic representation of a silicon wafer with a metal pattern formed thereon.

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