Abstract of the Disclosure

A method of producing metal patterns on silicon wafers prior to a thermomigration process, including covering the surface of a wafer completely with a metal film, producing a photoresist pattern on portions of the metal film corresponding to a predetermined thermomigration pattern, etching away the uncovered portions of the metal film, removing the photoresist film, and annealing the remaining metal film pattern.

• Figure 1 is a schematical representation of a silicon wafer having a metal film layer formed thereon.
• Figure 2 is a schematical representation of the metallized silicon wafer of Figure 1 with a photoresisted pattern formed thereon.
• Figure 3 is a schematic representation of a silicon wafer with a metal pattern formed thereon.

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