PATENT COVER GRAPHIC

United States Patent 4,203,127
May 13, 1980

Package And Method Of Packaging Semiconductor Wafers
Bruce R. Tegge, Jr.

Filed March 2, 1980
Image of US PATENT 4,203,127

Abstract of the Disclosure

A package and a method of packaging semiconductor devices, especially in expanded wafer form. The package is formed by sticking an adhesive backed ring to the plastic sheet upon which the expanded wafer is affixed so that the ring surrounds the wafer. The adhesive backed ring holds the plastic sheet securely and protects the surface of the wafer. The package is completed by covering the wafer with a second protective sheet and vacuum sealing in a plastic bag.
Figure descriptions: cover graphic

  • an exploded view showing the invention and the manner in which it can be employed. 

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National Museum of American History
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