United States Patent 4,203,127
May 13, 1980

Package And Method Of Packaging Semiconductor Wafers
Bruce R. Tegge, Jr.

Filed March 2, 1980
Image of US PATENT 4,203,127

Abstract of the Disclosure

A package and a method of packaging semiconductor devices, especially in expanded wafer form. The package is formed by sticking an adhesive backed ring to the plastic sheet upon which the expanded wafer is affixed so that the ring surrounds the wafer. The adhesive backed ring holds the plastic sheet securely and protects the surface of the wafer. The package is completed by covering the wafer with a second protective sheet and vacuum sealing in a plastic bag.
Figure descriptions: cover graphic

  • an exploded view showing the invention and the manner in which it can be employed.

 Citations [54]:
3,040,489 06/1962 Decosta 3,559,855 02/1971 Barnett 3,112,850 12/1963 Garibotti 3,562,258 02/1971 Boyd 3,396,452 08/1968 Sato et al 3,606,035 11/1970 Gantley 3,461,537 08/1969 Lotz 3,707,760 01/1973 Citrin 3,537,169 11/1970 Eigeman 3,762,973 10/1973 Gabrail 3,537,603 11/1970 Willis
National Museum of American History
HomeSearchChip TalkChip FunPatentsPeoplePicturesCreditsCopyrightComments