Abstract of the Disclosure

An electronic circuit package (11) includes a substrate (14) with leads (21) extending from at least one edge thereof. The leads (21) have a split end (26) formed by two slits (31,51). The slits divide the end into a lead stub (29) and a flag end (28). The flag end (28) is formed up in a step of approximately the thickness of the substrate (14). The forming of the flag end (28) foreshortens a flag support (32) to locate a flag (34) in substantial superposition to the lead stub (29). Both the lead stub and the flag (34) are solder bonded to respective bond pads (18) on the upper and lower major surfaces of the substrate (14)

• a pictorial representation of a film circuit DIP assembled in accordance with this invention.

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