PATENT COVER GRAPHIC |
United States Patent 4,552,833 November 12, 1985 Radiation Sensitive and Oxygen Plasma Developable Resist Hiroshi Ito Scott A. MacDonald Roberd D. Miller Carlton G. Willson Filed May 14, 1984 |
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Abstract of the DisclosureA negative tone resist emage is achieved by (1) coating a substrate with a film of a polymer containing a masked, reactive functionality; (2) imagewise exposing the film to radiation in a fashion such that the masked functionality is liberated; (3) contacting the film with an organimetallic reagent; (4) developing the relief image by the oxygen plasma etching |
Figure descriptions: no drawings |
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Citations [54]:4,307,177 12/1981 Crivello 4,307,178 12/1981 Kaplan et al. 4,389,482 06/1983 Bargon et al. 4,396,704 08/1983 Taylor 4,464,455 08/1984 Yoneda et al. 4,481,049 11/1984 Reichmanis et al. 4,481,279 11/1984 Naito et al. 5,517,276 05/1985 Lewis |
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