TI number: G00274
Substrate, Dual Inline Package - The item is a ceramic substrate for a 40 pin CDIP (ceramic dual inline package).

TI number: G00289
Headers Display, Hermetic Seal - This display shows a number of hermetic seal headers using ceramics and/or brazed submounts and leads. The purpose of the display was to illustrate the work done by the Hermetic Seals department. These items cover the period of about 1960 through about 1980.

Many of these items were in extensive production for a number of years.

Related material in collection: G00277-9, 288, 290. Summary comment by: Pete Johnson, Earl Sandburg, Ross Schraeder.

TI number: G00290
Headers Display, Developmental - This item is a display of a number of development headers made for different device projects. Production, if any, was limited. The time period represented is late 1960's to mid 1970's.

Related material in collection: G00277-9, 288-9. Summary comment by: Pete Johnson, Earl Sandburg, Ross Schraeder.

TI number: G00435
Packages, Hearing Aid Transistor - This package was designed in 1954 by TI and the package supplier for use in hearing aids. The goal was the smallest practical package in which a germanium grown junction transistor could be assembled. Also, adequate glass was required for electrical insulation.

This solder sealed package was successfully used for hearing aid transistors for a couple of years. The users switched to alloy type transistors for lower noise, and TI chose not to pursue the business because of the production demands of the germanium radio and the silicon transistors. This same package, minus the center lead, was used for silicon diodes which were introduced about March, 1954. Various types of diodes in this package were in production for several years.

Summary comment by: Norman Ince, Jim Lacy, Mark Shepherd.

TI number: G00445
Display Package, Numeric, LED - This item is the lead frame on mylar cast in clear plastic for the package used for G00444.

Related material in collection: G00444. Summary comment by: Bob Cole, Burt Marks.

TI number: G00251
Carrier, Integrated Circuit - The item is an experimental IC flatpack carrier made in the 1962-3 period.

The carrier was designed to support the flatpack and protect the leads. Also, it had features for mechanical handling and stacking. The major shortcoming was the lack of means for testing the IC while in the carrier.

Summary comment by: Willis Adcock, Jack Kilby, Charles Phipps.

TI number: L00229
Flatpack Welding Display - These displays were used as sales tools illustrating the welding of IC flatpack leads to a circuit board. The welder was developed in 1962-3.

With the introduction of integrated circuits and the flatpack package by TI, the Industrial Products group of the Apparatus Division developed and marketed a welder to weld the package leads to the circuit board. It was capable of automatically adjusting for variations in material thickness. This portion of Industrial Products subsequently evolved into a part of Data Systems.

Summary comment by: Ralph Dosher.

TI number: G00264
Integrated Circuit Package Strip - The item is the first IC plastic package strip molded at TI. It was molded on an SRDL press in June, 1996.

This engineering design was modified several times before being released for production, but the strip represents the first one by TI.

Summary comment by: Ross Schraeder.

TI number: G00406
Model, Integrated Circuit Flatpack - This is a display model of an IC in the 1/4in x 1/8in flatpack with partial cutaway lid. The date of the model is not known, but it is typical of the construction of the mid 1960's.

Summary comment by: Jim Lacy, Charles Phipps, Earl Wilson.

TI number: G00389
Transistor Packages Display - This display in plastic show some of the very early transistor packages used or considered for use by TI. From memory and the packages shown, this display was probably made in the latter part of 1953.

No. 1 is the package used for the first TI produced transistor. This was the package used by Bell Labs/Western Electric at the time of the licensing agreement. Nos. 2 - 4 are packages for the first TI designed transistors, germanium point contacts. Nos. 5 - 7 are packages of the designs being used in Engineering at the time for evaluation. At that time, the industry was in the process of developing a standard small signal transistor package. The package finally selected by TI was dimensionally very close to No. 7. The header had a kovar rim and leads sealed in glass. After fabrication of the transistor, the header was solder sealed to a metal can. The 1-53 on the front of No. 2 and the back of No. 3 indicate they were made in January, 1953.

Related material in collection: See G00001-3, 42-44 for examples of production devices of the period. Summary comment by: Boyd Cornelison, Steve Karnavas, Jim Lacy, Mark Shepherd.

TI number: G00277
Headers Display - This display case contains miscellaneous glass to metal seal headers built by TI for transistors and rectifiers.

This is a display built to show some of the wide variety of headers built in Hermetic Seals for use by the Semiconductor Group. The examples in the display indicate it was probably built in the early 1960's. The Hermetic Seals operation was started in the spring of 1959 and counted through 1982. During that period, it produced nearly 100% of the hermetic packages required by TI.

Related material in collection: G00278-9, 288-90. Summary comment by: Pete Johnson, Earl Sandberg, Ross Schraeder.

TI number: G00278
Headers Display - This display case contains miscellaneous glass to metal matched seal headers used for transistors, mostly variations of JEDEC TO-5 and TO-18 packages.

This display was built to illustrate the wide variety of matched seal transistor headers made in Hermetic Seals for use in the Semiconductor Group. Although JEDEC registration numbers were issued for the variations in length and number of leads, TI tended to use the nomenclature shown internally. For these types, Hermetic Seals produced 100% of the TI requirements. The display probably was built in the mid 1960's.

Related material in collection: G00277, 279, 288-90. Summary comment by: Pete Johnson, Earl Sandberg, Ross Schraeder.

TI number: G00279
Headers Display, Flatpack - This display contains a variety of metal flat-pack headers.

This display was built to illustrate the wide variety of metal flat-pack headers built in Hermetic Seals for use by the Semiconductor Group in producing integrated circuits and multichip transistors and diodes. "Masked" and "unmasked" refer to the gold plating on the internal base. Variations in the internal spacing was to allow for different size bars (chips) to minimize bond wire length. This display probably was built in the mid 1960's.

Related material in collection: G00277-8, 288-90. Summary comment by: Pete Johnson, Earl Sandberg, Ross Schraeder.

TI number: G00288
Headers Display, Hermetic Seal - The display shows an assortment of package headers built in Hermetic Seals. The examples are mostly for special purpose high reliability applications.

The display shows some of the variety of skills developed in providing packaging for semiconductor devices: plating, film deposition and patterning, glass to metal and ceramic to metal sealing. Some of these packages were produced in fairly high volume, but most were low volume for special applications.

Related material in collection: G00277-9, 289-90. Summary comment by: Pete Johnson, Earl Sandburg, Ross Schraeder.

TI number: G00039
Transistor Packages - Examples of 1955 studies of glass and plastic for packaging semiconductor devices. Included is a drawing of the germanium alloy transistor in the glass package.

TI introduced diodes in glass packages in 1954-5 but never used glass for transistors. Plastic was introduced for diodes, rectifiers and transistors about 1964. For transistors, glass prevented problems of sealing temperature, ruggedness and device sensitivity to light. The item was part of the original South Building lobby display. Display lists contributors as TIllery Townsend and Elmer Wolff.

Summary comment by: Elmer Wolff.

TI number: G00039
Transistor Packages - Examples of 1955 studies of glass and plastic for packaging semiconductor devices. Included is a drawing of the germanium alloy transistor in the glass package.

TI introduced diodes in glass packages in 1954-5 but never used glass for transistors. Plastic was introduced for diodes, rectifiers and transistors about 1964. For transistors, glass prevented problems of sealing temperature, ruggedness and device sensitivity to light. The item was part of the original South Building lobby display. Display lists contributors as TIllery Townsend and Elmer Wolff.

Summary comment by: Elmer Wolff.

TI number: G00093
Integrated Circuit Dummy Flatpack - In the introductory search for markets in 1962, TI gave the electronics industry a familiarity with integrated circuits by distributing thousands of dummy packages.

The dummy packages allowed potential users to become familiar with the form factor and to develop assembly techniques. Several thousand were distributed in the 1962-3 period. This item was part of the original South Building Lobby display.

Summary comment by: Willis Adcock, Jack Kilby, Charles Phipps.

TI number: G00093
Integrated Circuit Dummy Flatpack - In the introductory search for markets in 1962, TI gave the electronics industry a familiarity with integrated circuits by distributing thousands of dummy packages.

The dummy packages allowed potential users to become familiar with the form factor and to develop assembly techniques. Several thousand were distributed in the 1962-3 period. This item was part of the original South Building Lobby display.

Summary comment by: Willis Adcock, Jack Kilby, Charles Phipps.

TI number: G00093
Integrated Circuit Dummy Flatpack - In the introductory search for markets in 1962, TI gave the electronics industry a familiarity with integrated circuits by distributing thousands of dummy packages.

The dummy packages allowed potential users to become familiar with the form factor and to develop assembly techniques. Several thousand were distributed in the 1962-3 period. This item was part of the original South Building Lobby display.

Summary comment by: Willis Adcock, Jack Kilby, Charles Phipps.

TI number: G00093
Integrated Circuit Dummy Flatpack - In the introductory search for markets in 1962, TI gave the electronics industry a familiarity with integrated circuits by distributing thousands of dummy packages.

The dummy packages allowed potential users to become familiar with the form factor and to develop assembly techniques. Several thousand were distributed in the 1962-3 period. This item was part of the original South Building Lobby display.

Summary comment by: Willis Adcock, Jack Kilby, Charles Phipps.

TI number: G00093
Integrated Circuit Dummy Flatpack - In the introductory search for markets in 1962, TI gave the electronics industry a familiarity with integrated circuits by distributing thousands of dummy packages.

The dummy packages allowed potential users to become familiar with the form factor and to develop assembly techniques. Several thousand were distributed in the 1962-3 period. This item was part of the original South Building Lobby display.

Summary comment by: Willis Adcock, Jack Kilby, Charles Phipps.

TI number: G00093
Integrated Circuit Dummy Flatpack - In the introductory search for markets in 1962, TI gave the electronics industry a familiarity with integrated circuits by distributing thousands of dummy packages.

The dummy packages allowed potential users to become familiar with the form factor and to develop assembly techniques. Several thousand were distributed in the 1962-3 period. This item was part of the original South Building Lobby display.

Summary comment by: Willis Adcock, Jack Kilby, Charles Phipps.

TI number: G00093
Integrated Circuit Dummy Flatpack - In the introductory search for markets in 1962, TI gave the electronics industry a familiarity with integrated circuits by distributing thousands of dummy packages.

The dummy packages allowed potential users to become familiar with the form factor and to develop assembly techniques. Several thousand were distributed in the 1962-3 period. This item was part of the original South Building Lobby display.

Summary comment by: Willis Adcock, Jack Kilby, Charles Phipps.

TI number: G00093
Integrated Circuit Dummy Flatpack - In the introductory search for markets in 1962, TI gave the electronics industry a familiarity with integrated circuits by distributing thousands of dummy packages.

The dummy packages allowed potential users to become familiar with the form factor and to develop assembly techniques. Several thousand were distributed in the 1962-3 period. This item was part of the original South Building Lobby display.

Summary comment by: Willis Adcock, Jack Kilby, Charles Phipps.

TI number: G00093
Integrated Circuit Dummy Flatpack - In the introductory search for markets in 1962, TI gave the electronics industry a familiarity with integrated circuits by distributing thousands of dummy packages.

The dummy packages allowed potential users to become familiar with the form factor and to develop assembly techniques. Several thousand were distributed in the 1962-3 period. This item was part of the original South Building Lobby display.

Summary comment by: Willis Adcock, Jack Kilby, Charles Phipps.

TI number: G00030
Header Fabrication Display - Displays step by step fabrication of the first 1/4in x 1/8in IC flatpack header design.

The final seal for this package was made by solder sealed kovar lid. The ceramic base, ring frame and lead frame were sealed together with glass frit. This design was used in the 1959-62 time period.

Related material in collection: G00031. Summary comment by: Willis Adcock, Bill Brower, Jack Kilby.

TI number: G00031
Header Fabrication Display - Displays step by step fabrication of the second production version of the 1/4" x 1/8" IC flatpack.

The header has a kovar base plate stitch welded to the lead frame. The lead frame was sealed to the ring frame with glass frit. For final seal, a kovar lid was stitch welded to the ring frame. Production in this package was started in early 1963. Although refinements in the design were made from time to time, it remaind the basic flatpack and was used for many special transistor and diode applications as well as IC's.

Related material in collection: G00030 Summary comment by: Willis Adcock, Bill Brower, Jack Kilby.